Journal Article

PUBDB-2024-07502

http://join2-wiki.gsi.de/foswiki/pub/Main/Artwork/join2_logo100x88.png Pixel detector hybridisation and integration with anisotropic conductive adhesives

Volker, A. (Corresponding author) ; Schmidt, J. V. ; Dannheim, D. ; Svihra, P. ; Vicente Barreto Pinto, M. ; de Oliveira, R. ; Braach, J. ; Yang, X. ; Ruat, M. ; Magalhaes Suarez, D.CFEL*XFEL.EU*DESY* ; Centis Vignali, M. ; Calderini, G. ; Kristiansen, H.

2024
Inst. of Physics London

This record in other databases:    

Please use a persistent id in citations: doi:10.1088/1748-0221/19/05/C05024  doi:10.3204/PUBDB-2024-07502

Report No.: arXiv:2312.09883

Abstract: A reliable and cost-effective interconnect technology is required for the development ofhybrid pixel detectors. The interconnect technology needs to be adapted for the pitch and diesizes of the respective applications. This contribution presents recent results of a newlydeveloped in-house single-die interconnection process based on Anisotropic Conductive Adhesives(ACA). The ACA interconnect technology replaces solder bumps with conductive micro-particlesembedded in an epoxy layer applied as either film or paste. The electro-mechanical connectionbetween the sensor and ASIC is achieved via thermocompression of the ACA using a flip-chip devicebonder. The ACA technology can also be used for ASIC-PCB/FPC integration, replacing wire bondingor large-pitch solder bumping techniques. A specific pixel-pad topology is required to enable theconnection via micro-particles and create cavities into which excess epoxy can flow. Thispixel-pad topology is achieved with an in-house Electroless Nickel Immersion Gold (ENIG)process. The ENIG and ACA processes are qualified with a variety of different ASICs, sensors, anddedicated interconnect test structures, with pad diameters ranging from 12 μm to 140 μmand pitches between 20 μm and 1.3 mm. The produced assemblies are characterized electrically,with radioactive-source exposures, and in tests with high-momentum particle beams. Thiscontribution introduces the developed interconnect and plating processes and showcases differenthybrid assemblies produced and tested with the above-mentioned methods. A focus is placed onrecent optimization of the plating and interconnect processes, resulting in an improved platinguniformity and interconnect yield.

Note: Procceding to IPRD23 conference in Siena 2023

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Contributing Institute(s):

1. FS-Detektor Systeme (FS-DS)
2. Detector Operations (XFEL_DO_DD_DET)

Research Program(s):

1. 622 - Detector Technologies and Systems (POF4-622) (POF4-622)
2. AIDAinnova - Advancement and Innovation for Detectors at Accelerators (101004761) (101004761)

Experiment(s):

1. No specific instrument

Appears in the scientific report 2024

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Database coverage:
; ; ; Clarivate Analytics Master Journal List ; Current Contents - Physical, Chemical and Earth Sciences ; Essential Science Indicators ; IF < 5 ; JCR ; National-Konsortium ; SCOPUS ; Science Citation Index Expanded ; Web of Science Core Collection

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Linked articles:

http://join2-wiki.gsi.de/foswiki/pub/Main/Artwork/join2_logo100x88.png Preprint Volker, A. (Corresponding author) ; Schmidt, J. V. ; Dannheim, D. ; Svihra, P. ; Pinto, M. V. B. ; de Oliveira, R. ; Braach, J. ; Yang, X. ; Ruat, M. ; Magalhaes, D.CFEL*XFEL.EU*DESY* ; Centis Vignali, M. ; Calderini, G. ; Kristiansen, H.
Pixel detector hybridization and integration with anisotropic conductive adhesives
[10.3204/PUBDB-2024-00405]     Files  Fulltext by arXiv.org BibTeX | EndNote: XML, Text | RIS

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