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@ARTICLE{Volker:619244,
      author       = {Volker, Alexander and Schmidt, Janis Viktor and Dannheim,
                      Dominik and Svihra, Peter and Vicente Barreto Pinto, Mateus
                      and de Oliveira, Rui and Braach, Justus and Yang, Xiao and
                      Ruat, Marie and Magalhaes Suarez, Debora and Centis Vignali,
                      Matteo and Calderini, Giovanni and Kristiansen, Helge},
      title        = {{P}ixel detector hybridisation and integration with
                      anisotropic conductive adhesives},
      journal      = {Journal of Instrumentation},
      volume       = {19},
      number       = {05},
      issn         = {1748-0221},
      address      = {London},
      publisher    = {Inst. of Physics},
      reportid     = {PUBDB-2024-07502, arXiv:2312.09883},
      pages        = {C05024},
      year         = {2024},
      note         = {Procceding to IPRD23 conference in Siena 2023},
      abstract     = {A reliable and cost-effective interconnect technology is
                      required for the development ofhybrid pixel detectors. The
                      interconnect technology needs to be adapted for the pitch
                      and diesizes of the respective applications. This
                      contribution presents recent results of a newlydeveloped
                      in-house single-die interconnection process based on
                      Anisotropic Conductive Adhesives(ACA). The ACA interconnect
                      technology replaces solder bumps with conductive
                      micro-particlesembedded in an epoxy layer applied as either
                      film or paste. The electro-mechanical connectionbetween the
                      sensor and ASIC is achieved via thermocompression of the ACA
                      using a flip-chip devicebonder. The ACA technology can also
                      be used for ASIC-PCB/FPC integration, replacing wire
                      bondingor large-pitch solder bumping techniques. A specific
                      pixel-pad topology is required to enable theconnection via
                      micro-particles and create cavities into which excess epoxy
                      can flow. Thispixel-pad topology is achieved with an
                      in-house Electroless Nickel Immersion Gold (ENIG)process.
                      The ENIG and ACA processes are qualified with a variety of
                      different ASICs, sensors, anddedicated interconnect test
                      structures, with pad diameters ranging from 12 μm to 140
                      μmand pitches between 20 μm and 1.3 mm. The produced
                      assemblies are characterized electrically,with
                      radioactive-source exposures, and in tests with
                      high-momentum particle beams. Thiscontribution introduces
                      the developed interconnect and plating processes and
                      showcases differenthybrid assemblies produced and tested
                      with the above-mentioned methods. A focus is placed onrecent
                      optimization of the plating and interconnect processes,
                      resulting in an improved platinguniformity and interconnect
                      yield.},
      cin          = {FS-DS / $XFEL_DO_DD_DET$},
      ddc          = {610},
      cid          = {I:(DE-H253)FS-DS-20120731 /
                      $I:(DE-H253)XFEL_DO_DD_DET-20210408$},
      pnm          = {622 - Detector Technologies and Systems (POF4-622) /
                      AIDAinnova - Advancement and Innovation for Detectors at
                      Accelerators (101004761)},
      pid          = {G:(DE-HGF)POF4-622 / G:(EU-Grant)101004761},
      experiment   = {EXP:(DE-MLZ)NOSPEC-20140101},
      typ          = {PUB:(DE-HGF)16},
      eprint       = {2312.09883},
      howpublished = {arXiv:2312.09883},
      archivePrefix = {arXiv},
      SLACcitation = {$\%\%CITATION$ = $arXiv:2312.09883;\%\%$},
      UT           = {WOS:001228261500001},
      doi          = {10.1088/1748-0221/19/05/C05024},
      url          = {https://bib-pubdb1.desy.de/record/619244},
}