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@ARTICLE{Volker:601893,
      author       = {Volker, Alexander and Schmidt, Janis Viktor and Dannheim,
                      Dominik and Svihra, Peter and Pinto, Mateus Vicente Barreto
                      and de Oliveira, Rui and Braach, Justus and Yang, Xiao and
                      Ruat, Marie and Magalhaes, Débora and Centis Vignali,
                      Matteo and Calderini, Giovanni and Kristiansen, Helge},
      title        = {{P}ixel detector hybridization and integration with
                      anisotropic conductive adhesives},
      reportid     = {PUBDB-2024-00405, arXiv:2312.09883},
      year         = {2023},
      note         = {Procceding to IPRD23 conference in Siena 2023},
      abstract     = {A reliable and cost-effective interconnect technology is
                      required for the development of hybrid pixel detectors. The
                      interconnect technology needs to be adapted for the pitch
                      and die sizes of the respective applications. For
                      small-scale applications and during the ASIC and sensor
                      development phase, interconnect technologies must also be
                      suitable for the assembly of single-dies typically available
                      from Multi-Project-Wafer submissions. Within the CERN EP
                      $R\&D$ program and the AIDAinnova collaboration, innovative
                      and scalable hybridization concepts are under development
                      for pixel-detector applications in future colliders. This
                      contribution presents recent results of a newly developed
                      in-house single-die interconnection process based on
                      Anisotropic Conductive Adhesives (ACA). The ACA interconnect
                      technology replaces solder bumps with conductive
                      micro-particles embedded in an epoxy layer applied as either
                      film or paste. The electro-mechanical connection between the
                      sensor and ASIC is achieved via thermocompression of the ACA
                      using a flip-chip device bonder. A specific pixel-pad
                      topology is required to enable the connection via
                      micro-particles and create cavities into which excess epoxy
                      can flow. This pixel-pad topology is achieved with an
                      in-house Electroless Nickel Immersion Gold process that is
                      also under development within the project. The ENIG and ACA
                      processes are qualified with a variety of different ASICs,
                      sensors, and dedicated test structures, with pad diameters
                      ranging from 12 μm to 140 μm and pitches between 20 μm
                      and 1.3 mm. The produced assemblies are characterized
                      electrically, with radioactive-source exposures, and in
                      tests with high-momentum particle beams. A focus is placed
                      on recent optimization of the plating and interconnect
                      processes, resulting in an improved plating uniformity and
                      interconnect yield.},
      cin          = {FS-DS},
      cid          = {I:(DE-H253)FS-DS-20120731},
      pnm          = {622 - Detector Technologies and Systems (POF4-622)},
      pid          = {G:(DE-HGF)POF4-622},
      experiment   = {EXP:(DE-MLZ)NOSPEC-20140101},
      typ          = {PUB:(DE-HGF)25},
      eprint       = {2312.09883},
      howpublished = {arXiv:2312.09883},
      archivePrefix = {arXiv},
      SLACcitation = {$\%\%CITATION$ = $arXiv:2312.09883;\%\%$},
      doi          = {10.3204/PUBDB-2024-00405},
      url          = {https://bib-pubdb1.desy.de/record/601893},
}