TY  - JOUR
AU  - Volker, Alexander
AU  - Schmidt, Janis Viktor
AU  - Dannheim, Dominik
AU  - Svihra, Peter
AU  - Vicente Barreto Pinto, Mateus
AU  - de Oliveira, Rui
AU  - Braach, Justus
AU  - Yang, Xiao
AU  - Ruat, Marie
AU  - Magalhaes Suarez, Debora
AU  - Centis Vignali, Matteo
AU  - Calderini, Giovanni
AU  - Kristiansen, Helge
TI  - Pixel detector hybridisation and integration with anisotropic conductive adhesives
JO  - Journal of Instrumentation
VL  - 19
IS  - 05
SN  - 1748-0221
CY  - London
PB  - Inst. of Physics
M1  - PUBDB-2024-07502
M1  - arXiv:2312.09883
SP  - C05024
PY  - 2024
N1  - Procceding to IPRD23 conference in Siena 2023
AB  - A reliable and cost-effective interconnect technology is required for the development ofhybrid pixel detectors. The interconnect technology needs to be adapted for the pitch and diesizes of the respective applications. This contribution presents recent results of a newlydeveloped in-house single-die interconnection process based on Anisotropic Conductive Adhesives(ACA). The ACA interconnect technology replaces solder bumps with conductive micro-particlesembedded in an epoxy layer applied as either film or paste. The electro-mechanical connectionbetween the sensor and ASIC is achieved via thermocompression of the ACA using a flip-chip devicebonder. The ACA technology can also be used for ASIC-PCB/FPC integration, replacing wire bondingor large-pitch solder bumping techniques. A specific pixel-pad topology is required to enable theconnection via micro-particles and create cavities into which excess epoxy can flow. Thispixel-pad topology is achieved with an in-house Electroless Nickel Immersion Gold (ENIG)process. The ENIG and ACA processes are qualified with a variety of different ASICs, sensors, anddedicated interconnect test structures, with pad diameters ranging from 12 μm to 140 μmand pitches between 20 μm and 1.3 mm. The produced assemblies are characterized electrically,with radioactive-source exposures, and in tests with high-momentum particle beams. Thiscontribution introduces the developed interconnect and plating processes and showcases differenthybrid assemblies produced and tested with the above-mentioned methods. A focus is placed onrecent optimization of the plating and interconnect processes, resulting in an improved platinguniformity and interconnect yield.
LB  - PUB:(DE-HGF)16
UR  - <Go to ISI:>//WOS:001228261500001
DO  - DOI:10.1088/1748-0221/19/05/C05024
UR  - https://bib-pubdb1.desy.de/record/619244
ER  -