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| Journal Article | PUBDB-2025-04380 |
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2025
Springer
Heidelberg
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Please use a persistent id in citations: doi:10.1140/epjc/s10052-025-14341-4 doi:10.3204/PUBDB-2025-04380
Abstract: Two samples of silicon pad sensors and two samples of GaAs sensors are studied in an electron beam with 5 GeV energy from the DESY-II test-beam facility. The sizes of the silicon and GaAs sensors are about 9 $\times $ 9 $\hbox {cm}^2$ and 5 $\times $ 8 $\hbox {cm}^2$, respectively. The thickness is 500 µm for both the silicon and GaAs sensors. The pad size is about 5 $\times $ 5 $\hbox {mm}^2$. The sensors are foreseen to be used in a compact electromagnetic sampling calorimeter. The readout of the pads is done via traces connected to the pads and the front-end ASICs at the edges of the sensors. For the silicon sensors, copper traces on a Kapton foil are connected to the sensor pads with conducting glue. The pads of the GaAs sensors are connected to bond-pads via aluminium traces on the sensor substrate. The readout is based on a dedicated front-end ASIC, called FLAME. Pre-processing of the raw data and deconvolution is performed with FPGAs. The whole system is orchestrated by a Trigger Logic Unit. Results are shown for the signal-to-noise ratio, the homogeneity of the response, edge effects on pads, cross talk and wrongly assigned signals due to the readout traces.
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