%0 Journal Article
%A Abramowicz, H.
%A Soto, M. Almanza
%A Benhammou, Y.
%A Elad, M.
%A Firlej, M.
%A Fiutowski, T.
%A Ghenescu, V.
%A Grzelak, G.
%A Horn, D.
%A Huang, S.
%A Idzik, M.
%A Irles, A.
%A Levy, Aharon
%A Levy, Itamar
%A Lohmann, Wolfgang
%A Moroń, J.
%A Neagu, A. T.
%A Pietruch, D.
%A Potlog, P. M.
%A Świentek, K.
%A Żarnecki, A. F.
%A Zembaczyński, K.
%T Novel silicon and GaAs sensors for compact sampling calorimeters
%J The European physical journal / C
%V 85
%N 6
%@ 1434-6044
%C Heidelberg
%I Springer
%M PUBDB-2025-04380
%P 684
%D 2025
%X Two samples of silicon pad sensors and two samples of GaAs sensors are studied in an electron beam with 5 GeV energy from the DESY-II test-beam facility. The sizes of the silicon and GaAs sensors are about 9 × 9 cm<sup>2</sup> and 5 × 8 cm<sup>2</sup>, respectively. The thickness is 500 µm for both the silicon and GaAs sensors. The pad size is about 5 × 5 mm<sup>2</sup>. The sensors are foreseen to be used in a compact electromagnetic sampling calorimeter. The readout of the pads is done via traces connected to the pads and the front-end ASICs at the edges of the sensors. For the silicon sensors, copper traces on a Kapton foil are connected to the sensor pads with conducting glue. The pads of the GaAs sensors are connected to bond-pads via aluminium traces on the sensor substrate. The readout is based on a dedicated front-end ASIC, called FLAME. Pre-processing of the raw data and deconvolution is performed with FPGAs. The whole system is orchestrated by a Trigger Logic Unit. Results are shown for the signal-to-noise ratio, the homogeneity of the response, edge effects on pads, cross talk and wrongly assigned signals due to the readout traces.
%F PUB:(DE-HGF)16
%9 Journal Article
%R 10.1140/epjc/s10052-025-14341-4
%U https://bib-pubdb1.desy.de/record/639279