TY  - JOUR
AU  - Abramowicz, H.
AU  - Soto, M. Almanza
AU  - Benhammou, Y.
AU  - Elad, M.
AU  - Firlej, M.
AU  - Fiutowski, T.
AU  - Ghenescu, V.
AU  - Grzelak, G.
AU  - Horn, D.
AU  - Huang, S.
AU  - Idzik, M.
AU  - Irles, A.
AU  - Levy, Aharon
AU  - Levy, Itamar
AU  - Lohmann, Wolfgang
AU  - Moroń, J.
AU  - Neagu, A. T.
AU  - Pietruch, D.
AU  - Potlog, P. M.
AU  - Świentek, K.
AU  - Żarnecki, A. F.
AU  - Zembaczyński, K.
TI  - Novel silicon and GaAs sensors for compact sampling calorimeters
JO  - The European physical journal / C
VL  - 85
IS  - 6
SN  - 1434-6044
CY  - Heidelberg
PB  - Springer
M1  - PUBDB-2025-04380
SP  - 684
PY  - 2025
AB  - Two samples of silicon pad sensors and two samples of GaAs sensors are studied in an electron beam with 5 GeV energy from the DESY-II test-beam facility. The sizes of the silicon and GaAs sensors are about 9 × 9 cm<sup>2</sup> and 5 × 8 cm<sup>2</sup>, respectively. The thickness is 500 µm for both the silicon and GaAs sensors. The pad size is about 5 × 5 mm<sup>2</sup>. The sensors are foreseen to be used in a compact electromagnetic sampling calorimeter. The readout of the pads is done via traces connected to the pads and the front-end ASICs at the edges of the sensors. For the silicon sensors, copper traces on a Kapton foil are connected to the sensor pads with conducting glue. The pads of the GaAs sensors are connected to bond-pads via aluminium traces on the sensor substrate. The readout is based on a dedicated front-end ASIC, called FLAME. Pre-processing of the raw data and deconvolution is performed with FPGAs. The whole system is orchestrated by a Trigger Logic Unit. Results are shown for the signal-to-noise ratio, the homogeneity of the response, edge effects on pads, cross talk and wrongly assigned signals due to the readout traces.
LB  - PUB:(DE-HGF)16
DO  - DOI:10.1140/epjc/s10052-025-14341-4
UR  - https://bib-pubdb1.desy.de/record/639279
ER  -