Home > Publications database > Experiences and Lessons Learned from the End-of-Substructure card production of the ATLAS ITk Strip Upgrade |
Journal Article/Contribution to a conference proceedings | PUBDB-2024-06416 |
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2025
Inst. of Physics
London
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Please use a persistent id in citations: doi:10.1088/1748-0221/20/02/C02020 doi:10.3204/PUBDB-2024-06416
Report No.: ATL-COM-ITK-2024-125
Abstract: The silicon tracker of the ATLAS experiment will be upgraded for the upcoming High-Luminosity Upgrade of the LHC. The main building blocks of the new strip tracker are modules that consist of silicon sensors and hybrid PCBs hosting the read-out ASICs. The modules are mounted on rigid carbon-fiber substructures, known as staves in the central barrel region and petals in the end-cap regions, that provide common services to all the modules. At the end of each stave or petal side, a so-called End-of-Substructure (EoS) card facilitates the transfer of data, power, and control signals between the modules and the off-detector systems. The EoS connects up to 28 data lines to one or two lpGBT chips that provide data serialization and uses a 10Gbit s−1 versatile optical link to transmit signals to the off-detector systems. To meet the tight integration requirements in the detector, several different EoS card designs are needed. The power to the EoS is provided by a dedicated dual-stage DC-DC package providing 2.5V and 1.2V to the EoS cards. As the EoS production of almost 2000 EoS cards and accompanying DC-DC converters is getting close to completion, the production experience including detailed QC statistics and design validation (QA) results is reported on.
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