Towards a New Generation of Monolithic Active Pixel Sensors

Chauhan, Ankur; Mulyanto, Budi; Hansen, Karsten; Gregor, Ingrid-Maria; Mendes, Larissa; Simancas, Adriana; Spannagel, Simon; Reckleben, Christian; Huth, Lennart; Rastorguev, Daniil; Feindt, Finn; Velyka, Anastasiia; Vignola, Gianpiero; Stanitzki, Marcel; Eckstein, Doris; Wennlöf, Håkan Lennart Olov; Daza, Sara Ruiz; Viera, Manuel Del Rio; Schütze, Paul

doi:10.1016/j.nima.2022.167821

Journal Article/Contribution to a conference proceedings

PUBDB-2022-03571

Towards a New Generation of Monolithic Active Pixel Sensors

Chauhan, A. ; Viera, M. D. R. ; Eckstein, D. ; Feindt, F. (Corresponding author)DESY* ; Gregor, I.-M.DESY* ; Hansen, K. ; Huth, L.DESY* ; Mendes, L. ; Mulyanto, B. ; Rastorguev, D. ; Reckleben, C. ; Daza, S. R. ; Schütze, P. ; Simancas, A. ; Spannagel, S.DESY* ; Stanitzki, M.DESY* ; Velyka, A. ; Vignola, G. ; Wennlöf, H. L. O.DESY*

2023
North-Holland Publ. Co. Amsterdam

Proceedings of the 15th Pisa Meeting on Advanced Detectors, PM2021, Elba, Italy, 22 May 2022 - 28 May 2022 Nuclear instruments & methods in physics research / A 1047, 167821 (2023) [10.1016/j.nima.2022.167821] special issue: "Proceedings of the 15th Pisa Meeting on Advanced Detectors"

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Please use a persistent id in citations: doi:10.1016/j.nima.2022.167821 doi:10.3204/PUBDB-2022-03571

Report No.: arXiv:2210.09810

Abstract: A new generation of Monolithic Active Pixel Sensors (MAPS), produced in a 65 nm CMOS imaging process, promises higherdensities of on-chip circuits and, for a given pixel size, more sophisticated in-pixel logic compared to larger feature size processes.MAPS are a cost-effective alternative to hybrid pixel sensors since flip-chip bonding is not required. In addition, they allow forsignificant reductions of the material budget of detector systems, due to the smaller physical thicknesses of the active sensor andthe absence of a separate readout chip.The TANGERINE project develops a sensor suitable for future Higgs factories as well as sensor in a beam telescope for beam-testfacilities. The sensors will have small collection electrodes (order of μm), to maximize the signal-to-noise ratio, which allows tominimize power dissipation in the circuitry. The first batch of test chips, featuring full front-end amplifiers with Krummenacherfeedback, was produced and tested at the Mainzer Mikrotron (MAMI) at the end of 2021. MAMI provides an electron beam withcurrents up to 100 μA and an energy of 855 MeV. The analog output signal of the test chips was recorded with a high bandwidthoscilloscope and used to study the charge-sensitive amplifier of the chips in terms of waveform analysis. A beam telescope wasused as a reference system, to allow for track-based analysis of the recorded data.

Keyword(s): detector, pixel ; semiconductor detector, pixel ; matter, geometry ; pixel, size ; electron, beam ; density, high ; amplifier ; Mainz Linac ; feedback ; hybrid ; readout ; imaging ; logic ; dissipation ; electrode ; Higgs-factory

Classification:

ddc:530

Note: 3 pages, 2 figures, presented at 15th Pisa Meeting on Advanced Detectors Nuclear instruments & methods in physics research / A (2022) special issue: "Proceedings of the 15th Pisa Meeting on Advanced Detectors"

Contributing Institute(s):

Research Program(s):

611 - Fundamental Particles and Forces (POF4-611) (POF4-611)

Experiment(s):

DESY: TestBeamline 21 (DESY II)

Appears in the scientific report 2022

Database coverage:
Medline

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