000480224 001__ 480224 000480224 005__ 20250715175959.0 000480224 0247_ $$2INSPIRETeX$$aChauhan:2022inm 000480224 0247_ $$2inspire$$ainspire:2166940 000480224 0247_ $$2arXiv$$aarXiv:2210.09810 000480224 0247_ $$2altmetric$$aaltmetric:137371792 000480224 0247_ $$2doi$$a10.1016/j.nima.2022.167821 000480224 0247_ $$2ISSN$$a1872-9576 000480224 0247_ $$2ISSN$$a0168-9002 000480224 0247_ $$2datacite_doi$$a10.3204/PUBDB-2022-03571 000480224 0247_ $$2WOS$$aWOS:000920230000025 000480224 0247_ $$2openalex$$aopenalex:W4309332356 000480224 037__ $$aPUBDB-2022-03571 000480224 041__ $$aEnglish 000480224 082__ $$a530 000480224 088__ $$2arXiv$$aarXiv:2210.09810 000480224 1001_ $$aChauhan, Ankur$$b0 000480224 1112_ $$aProceedings of the 15th Pisa Meeting on Advanced Detectors$$cElba$$d2022-05-22 - 2022-05-28$$gPM2021$$wItaly 000480224 245__ $$aTowards a New Generation of Monolithic Active Pixel Sensors 000480224 260__ $$aAmsterdam$$bNorth-Holland Publ. Co.$$c2023 000480224 300__ $$a3 000480224 3367_ $$2ORCID$$aCONFERENCE_PAPER 000480224 3367_ $$033$$2EndNote$$aConference Paper 000480224 3367_ $$0PUB:(DE-HGF)16$$2PUB:(DE-HGF)$$aJournal Article$$mjournal 000480224 3367_ $$2BibTeX$$aINPROCEEDINGS 000480224 3367_ $$2DRIVER$$aconferenceObject 000480224 3367_ $$2DataCite$$aOutput Types/Conference Paper 000480224 3367_ $$0PUB:(DE-HGF)8$$2PUB:(DE-HGF)$$aContribution to a conference proceedings$$bcontrib$$mcontrib$$s1688387566_2016054 000480224 500__ $$a3 pages, 2 figures, presented at 15th Pisa Meeting on Advanced Detectors Nuclear instruments & methods in physics research / A (2022) special issue: "Proceedings of the 15th Pisa Meeting on Advanced Detectors" 000480224 520__ $$aA new generation of Monolithic Active Pixel Sensors (MAPS), produced in a 65 nm CMOS imaging process, promises higherdensities of on-chip circuits and, for a given pixel size, more sophisticated in-pixel logic compared to larger feature size processes.MAPS are a cost-effective alternative to hybrid pixel sensors since flip-chip bonding is not required. In addition, they allow forsignificant reductions of the material budget of detector systems, due to the smaller physical thicknesses of the active sensor andthe absence of a separate readout chip.The TANGERINE project develops a sensor suitable for future Higgs factories as well as sensor in a beam telescope for beam-testfacilities. The sensors will have small collection electrodes (order of μm), to maximize the signal-to-noise ratio, which allows tominimize power dissipation in the circuitry. The first batch of test chips, featuring full front-end amplifiers with Krummenacherfeedback, was produced and tested at the Mainzer Mikrotron (MAMI) at the end of 2021. MAMI provides an electron beam withcurrents up to 100 μA and an energy of 855 MeV. The analog output signal of the test chips was recorded with a high bandwidthoscilloscope and used to study the charge-sensitive amplifier of the chips in terms of waveform analysis. 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