Journal Article (Erratum/Correction)

PUBDB-2026-01087

http://join2-wiki.gsi.de/foswiki/pub/Main/Artwork/join2_logo100x88.png Erratum: Quality concerns caused by quality control — deformation of silicon strip detector modules in thermal cycling tests

Salami, R. ; Poley, L. ; Affolder, K. ; Affolder, T. ; Bayer, L.DESY* ; Crick, B. ; Duden, E. ; Dyckes, I. G. ; Fadeyev, V. ; Fortman, A. ; Federič, P. ; Franconi, L.DESY* ; Gignac, M. ; Gupta, S. ; Hallford, J.DESY* ; Helling, C. ; Hill, E. ; Hu, M. ; Kroll, J. ; Kumari, P. ; Lacasta, C. ; Levagood, M. ; Lopez, H. ; Morelos-Zaragoza, L. ; Moshe, M. R. ; Petersen, A. ; Platero, V. ; Rajagopalan, A. D. ; Sitnikova, L. ; Solaz, C. ; Soldevila, U. ; Speers, P. ; Van Nieuwenhuizen, G. ; Wang, A. Z.

2025
Inst. of Physics London

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Please use a persistent id in citations: doi:10.1088/1748-0221/20/12/E12001  doi:10.3204/PUBDB-2026-01087

Abstract: The ATLAS experiment at the Large Hadron Collider (LHC) iscurrently preparing to replace its present Inner Detector (ID) withthe upgraded, all-silicon Inner Tracker (ITk) for itsHigh-Luminosity upgrade (HL-LHC). The ITk will consist of acentral pixel tracker and the outer strip tracker, consisting ofabout 19,000 strip detector modules. Each strip module is assembledfrom up to two sensors, and up to five flexes (depending on itsgeometry) in a series of gluing, wirebonding and quality controlsteps. During detector operation, modules will be cooled down totemperatures of about -35 $^{∘}$C (corresponding to thetemperature of the support structures on which they will be mounted)after being initially assembled and stored at room temperature. Inorder to ensure compatibility with the detector's operatingtemperature range, modules are subjected to thermal cycling as partof their quality control process. Ten cycles between-35 $^{∘}$C and +40 $^{∘}$C are performed for eachmodule, with full electrical characterisation tests at each high andlow temperature point. As part of an investigation into the stressexperienced by modules during cooling, it was observed that modulesgenerally showed a change in module shape before and after thermalcycling. This paper presents a summary of the discovery andunderstanding of the observed changes, connecting them with excessmodule stress, as well as the resulting modifications to the modulethermal cycling procedure.

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Contributing Institute(s):

1. LHC/ATLAS Experiment (ATLAS)

Research Program(s):

1. 611 - Fundamental Particles and Forces (POF4-611) (POF4-611)

Experiment(s):

1. LHC: ATLAS

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Database coverage:
; ; ; Clarivate Analytics Master Journal List ; Current Contents - Physical, Chemical and Earth Sciences ; Essential Science Indicators ; IF < 5 ; JCR ; National-Konsortium ; SCOPUS ; Science Citation Index Expanded ; Web of Science Core Collection

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Linked articles:

http://join2-wiki.gsi.de/foswiki/pub/Main/Artwork/join2_logo100x88.png Journal Article Salami, R. (Corresponding author) ; Poley, L. ; Affolder, K. ; Affolder, T. ; Bayer, L.DESY* ; Crick, B. ; Duden, E. ; Dyckes, I. G. ; Fadeyev, V. ; Fortman, A. ; Federič, P. ; Franconi, L.DESY* ; Gignac, M. ; Gupta, S. ; Hallford, J.DESY* ; Helling, C. ; Hill, E. ; Hu, M. ; Kroll, J. ; Kumari, P. ; Lacasta, C. ; Levagood, M. ; Lopez, H. ; Morelos-Zaragoza, L. ; Moshe, M. R. ; Petersen, A. ; Platero, V. ; Rajagopalan, A. D. ; Sitnikova, L. ; Solaz, C. ; Soldevila, U. ; Speers, P. ; Van Nieuwenhuizen, G. ; Wang, A. Z.
Quality concerns caused by quality control — deformation of silicon strip detector modules in thermal cycling tests
Journal of Instrumentation 20(03), P03004 (2025) [10.1088/1748-0221/20/03/P03004]2025     Files  Fulltext by arXiv.org BibTeX | EndNote: XML, Text | RIS

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