Preprint

PUBDB-2025-05329

http://join2-wiki.gsi.de/foswiki/pub/Main/Artwork/join2_logo100x88.png Quality concerns caused by quality control — deformation of silicon strip detector modules in thermal cycling tests

Salami, R. (Corresponding author) ; Poley, L. ; Affolder, K. ; Affolder, T. ; Bayer, L. ; Crick, B. ; Duden, E. ; Dyckes, I. G. ; Fadeyev, V. ; Fortman, A. ; Federič, P. ; Franconi, L.DESY* ; Gignac, M. ; Gupta, S. ; Hallford, J.DESY* ; Helling, C. ; Hill, E. ; Hu, M. ; Kroll, J. ; Kumari, P. ; Lacasta, C. ; Levagood, M. ; Lopez, H. ; Morelos-Zaragoza, L. ; Moshe, M. R. ; Petersen, A. ; Platero, V. ; Rajagopalan, A. D. ; Sitnikova, L. ; Solaz, C. ; Soldevila, U. ; Speers, P. ; Van Nieuwenhuizen, G. ; Wang, A. Z.

2025

This record in other databases:    

Please use a persistent id in citations: doi:10.3204/PUBDB-2025-05329

Report No.: arXiv:2503.03133

Abstract: The ATLAS experiment at the Large Hadron Collider (LHC) iscurrently preparing to replace its present Inner Detector (ID) withthe upgraded, all-silicon Inner Tracker (ITk) for itsHigh-Luminosity upgrade (HL-LHC). The ITk will consist of acentral pixel tracker and the outer strip tracker, consisting ofabout 19,000 strip detector modules. Each strip module is assembledfrom up to two sensors, and up to five flexes (depending on itsgeometry) in a series of gluing, wirebonding and quality controlsteps. During detector operation, modules will be cooled down totemperatures of about -35 $^{∘}$C (corresponding to thetemperature of the support structures on which they will be mounted)after being initially assembled and stored at room temperature. Inorder to ensure compatibility with the detector's operatingtemperature range, modules are subjected to thermal cycling as partof their quality control process. Ten cycles between-35 $^{∘}$C and +40 $^{∘}$C are performed for eachmodule, with full electrical characterisation tests at each high andlow temperature point. As part of an investigation into the stressexperienced by modules during cooling, it was observed that modulesgenerally showed a change in module shape before and after thermalcycling. This paper presents a summary of the discovery andunderstanding of the observed changes, connecting them with excessmodule stress, as well as the resulting modifications to the modulethermal cycling procedure.

Keyword(s): Particle tracking detectors (Solid-state detectors) ; Si microstrip and pad detectors ; Solid state detectors ; Radiation-hard detectors

Note: JINST 20 P03004 (2025)

---

Contributing Institute(s):

1. LHC/ATLAS Experiment (ATLAS)

Research Program(s):

1. 611 - Fundamental Particles and Forces (POF4-611) (POF4-611)

Experiment(s):

1. LHC: ATLAS

---

Database coverage:
;

---