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@MASTERSTHESIS{Feyens:638146,
      author       = {Feyens, Ono},
      othercontributors = {Spannagel, Simon and Ruiz Daza, Sara},
      title        = {{G}razing {A}ngle {T}est {B}eam {S}tudies of the
                      {H}ybrid-to-{M}onolithic {M}aps {P}rototype},
      school       = {Vrije Universiteit Brussel},
      type         = {Masterarbeit},
      address      = {Hamburg},
      publisher    = {Verlag Deutsches Elektronen-Synchrotron},
      reportid     = {PUBDB-2025-03980, DESY-THESIS-2025-018},
      series       = {DESY-THESIS},
      pages        = {71},
      year         = {2025},
      note         = {Masterarbeit, Vrije Universiteit Brussel, 2025},
      abstract     = {The Tangerine group at DESY, Hamburg, investigates the
                      potential of Monolithic Active PixelSensors (MAPS)
                      manufactured in a novel 65 nm CMOS imaging process with
                      small collectionelectrode design, as a candidate technology
                      for vertex and tracking detectors in future leptoncollider
                      experiments. One of the activities undertaken to explore the
                      technology is the char-acterisation of prototypes through
                      the analysis of test beam measurements. The device undertest
                      in this thesis is the Hybrid-to-Monolithic (H2M) chip. The
                      investigated property is theactive thickness of the sensor.
                      This is done via the so-called grazing angle method, in
                      whichinformation about the charge collection as a function
                      of depth inside the sensor is generatedthrough the use of
                      ionizing particles impinging the sensor under shallow
                      angles. This conceptis practically realized through the
                      conduction of test beam measurements, and a two-step
                      dataanalysis procedure, in which first the data were
                      organized and then charge collection profileswere
                      constructed, displaying the amount of collected charge as a
                      function of depth inside thesensor. The total active
                      thickness is found to be approximately 13 μm, of which ∼
                      2 μm corre-sponds to an incomplete collection close to the
                      sensor surface, followed by ∼ 6 μm of uniformcollection
                      and ∼ 5 μm of exponentially decreasing collected amount
                      of charge. The impact ofseveral chip parameters on the
                      active thickness is investigated. Backside thinning to 25
                      μm, im-pinging the sensor from sensor surface or backside,
                      varying hit detection threshold, and changesin applied
                      sensor bias voltage are all found to not significantly
                      influence the active thickness ofthe sensor. The results
                      furthermore validated the function of the threshold and ToT
                      calibrationprocedure to correct for non-linear electronics
                      responses.},
      cin          = {ATLAS},
      cid          = {I:(DE-H253)ATLAS-20120731},
      pnm          = {611 - Fundamental Particles and Forces (POF4-611)},
      pid          = {G:(DE-HGF)POF4-611},
      experiment   = {EXP:(DE-H253)LHC-Exp-ATLAS-20150101},
      typ          = {PUB:(DE-HGF)3 / PUB:(DE-HGF)19},
      doi          = {10.3204/PUBDB-2025-03980},
      url          = {https://bib-pubdb1.desy.de/record/638146},
}