%0 Conference Paper
%A Palmelund, Anders
%A Arranca Menezes Trigueiros da Silva, André Filipe
%A Boebel, Artur Lorenz
%A Garvey, Cameron Michael
%A Ceslik, Harald
%A Gregor, Ingrid-Maria
%A Keaveney, James Michael
%A Strom, Lars Rickard
%A Bauckhage, Lukas
%A Stanitzki, Marcel
%A Dam, Mogens
%A Goettlicher, Peter
%A Gotfredsen, René Stennow
%A Ruiz Daza, Sara
%A Diez Cornell, Sergio
%A Schmitt, Stefan
%T Experiences and Lessons Learned from the End-of-Substructure card production of the ATLAS ITk Strip Upgrade
%M PUBDB-2024-07087
%D 2024
%X The silicon tracker of the ATLAS experiment will be upgraded for the upcoming High-Luminosity Upgrade of the LHC. The main building blocks of the new strip tracker are modules that consist of silicon sensors and hybrid PCBs hosting the read-out ASICs. The modules are mounted on rigid carbon-fiber substructures, known as staves in the central barrel region and petals in the end-cap regions, that provide common services to all the modules. At the end of each stave or petal side, a so-called End-of-Substructure (EoS) card facilitates the transfer of data, power, and control signals between the modules and the off-detector systems. The EoS connects up to 28 data lines to one or two lpGBT chips that provide data serialization and uses a 10Gbit s−1 versatile optical link to transmit signals to the off-detector systems. To meet the tight integration requirements in the detector, several different EoS card designs are needed. The power to the EoS is provided by a dedicated dual-stage DC-DC package providing 2.5V and 1.2V to the EoS cards. As the EoS production of almost 2000 EoS cards and accompanying DC-DC converters is getting close to completion, the production experience including detailed QC statistics and design validation (QA) results is reported on.
%B Topical Workshop on Electronics For Particle Physics
%C 30 Sep 2024 - 4 Oct 2024, Glasgow (UK)
Y2 30 Sep 2024 - 4 Oct 2024
M2 Glasgow, UK
%F PUB:(DE-HGF)24
%9 Poster
%U https://bib-pubdb1.desy.de/record/617826