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@INPROCEEDINGS{Stanitzki:617798,
      author       = {Stanitzki, Marcel and Bauckhage, Lukas and Boebel, Artur
                      and Ceslik, Harald and Dam, Mogens and Arranca Menezes
                      Trigueiros da Silva, André Filipe and Diez Cornell, Sergio
                      and Garvey, Cameron Michael and Göttlicher, Peter and
                      Godfredsen, Rene Stennow and Gregor, Ingrid-Maria and
                      Keaveney, James Michael and Palmelund, Anders and Ruiz Daza,
                      Sara and Schmitt, Stefan and Stroem, Lars Rickard},
      title        = {{T}he {E}nd-of-{S}ubstructure card for the {ATLAS} {IT}k
                      {S}trip {U}pgrade: {L}essons learned from the full
                      production},
      reportid     = {PUBDB-2024-07059},
      year         = {2024},
      abstract     = {The ATLAS Strip Tracker for HL-LHC consists of so-called
                      modules that host the silicon sensors and the front-end
                      electronics. These units are then mounted on mechanical
                      structures, the so-called staves and petals, which are
                      hosting up to 14 modules per side. An End-of-Substructure
                      (EoS) card connects up to 28 data lines from the modules to
                      and up to 12 lines from the lpGBT ASIC. The lpGBT then does
                      (De-)Serialization and connects to the VL+ ASICs which then
                      provides a 10 GBit/s optical data transmission to the
                      off-detector systems respectively. The EoS is powered by a
                      dedicated Dual-Stage DC-DC converter unit. As the both
                      staves and petals host modules on both sides, two EoS are
                      required for each stave and petal, however to reduce
                      cabling, they are sharing a single voltage connector. While
                      schematically the EoS cards are very closely related,
                      especially for the barrel each layer requires a distinct
                      layout, which adds complexity also for testing. As the EoS
                      production of almost 2000 EoS cards and the accompanying
                      2000 DC-DC converters is going to be completed in fall 2024,
                      we report on the production experience including detailed QC
                      statistics. We conclude with a few lessons learned during
                      the project duration.},
      month         = {Oct},
      date          = {2024-10-26},
      organization  = {IEEE NSS MIC RTSD, Tampa (USA), 26 Oct
                       2024 - 2 Nov 2024},
      cin          = {ATLAS / FE / FEA / FEB / FTX},
      cid          = {I:(DE-H253)ATLAS-20120731 / I:(DE-H253)FE-20120731 /
                      I:(DE-H253)FEA-20120731 / I:(DE-H253)FEB-20120731 /
                      I:(DE-H253)FTX-20210408},
      pnm          = {611 - Fundamental Particles and Forces (POF4-611)},
      pid          = {G:(DE-HGF)POF4-611},
      experiment   = {EXP:(DE-H253)LHC-Exp-ATLAS-20150101},
      typ          = {PUB:(DE-HGF)24},
      url          = {https://bib-pubdb1.desy.de/record/617798},
}