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@ARTICLE{Ceccarelli:602028,
      author       = {Ceccarelli, Rudy},
      collaboration = {CMS {Tracker Collaboration}},
      title        = {{P}erformance of highly irradiated {FBK} planar and 3{D}
                      pixel detectors},
      journal      = {Nuclear instruments $\&$ methods in physics research /
                      Section A},
      volume       = {1046},
      issn         = {0167-5087},
      address      = {Amsterdam},
      publisher    = {North-Holland Publ. Co.},
      reportid     = {PUBDB-2024-00476, CMS-CR-2022-075},
      pages        = {167650},
      year         = {2023},
      abstract     = {The High Luminosity upgrade of the CERN Large Hadron
                      Collider (HL-LHC) requires new radiation tolerant silicon
                      pixel sensors. In the case of the CMS experiment, the first
                      layer of pixel detectors will be installed at about 3 cm
                      from the beam line, where an integrated fluence of about 20
                      × 10$^{15}$ n$_{eq}$cm$^{−2}$ (1 MeV equivalent neutrons)
                      is expected (HL-LHC Runs 4 and 5). The first tracker layer
                      will be substituted before the start of HL-LHC Run 6. The 3D
                      concept for silicon pixel sensors presents several
                      advantages with respect to traditional (planar) sensors.
                      Thanks to short anode-to-cathode distances, 3D sensors are
                      much more resistant to radiation damage, making them
                      suitable for use in the inner layer of the future tracker.
                      This paper describes results from beam tests with highly
                      irradiated planar and 3D sensor and RD53A readout chip
                      combinations. RD53A is the first prototype in 65 nm
                      technology developed by the RD53 collaboration for use in
                      HL-LHC pixel detectors. The sensors were made in FBK foundry
                      in Trento, Italy, and their development was done in
                      collaboration with INFN (Istituto Nazionale di Fisica
                      Nucleare, Italy). Both planar and 3D sensors feature a pixel
                      area of 2500 μm2 and an active thickness of 150 μm. The
                      pixel detectors, irradiated to fluences up to 24 ×
                      10$^{15}$ n$_{eq}$cm$^{−2}$, were tested in the DESY test
                      beam facility and the analysis of the data shows excellent
                      performances even for the highest irradiation fluences. All
                      results are obtained in the framework of the CMS R\&D
                      activities.},
      month         = {May},
      date          = {2022-05-22},
      organization  = {15th Pisa Meeting on Advanced
                       Detectors, La Biodola (Italy), 22 May
                       2022 - 28 May 2022},
      keywords     = {activity report (INSPIRE) / radiation: damage (INSPIRE) /
                      luminosity: upgrade (INSPIRE) / irradiation (INSPIRE) /
                      tracking detector: upgrade (INSPIRE) / semiconductor
                      detector: pixel (INSPIRE) / performance (INSPIRE) / CMS
                      (INSPIRE) / electronics: readout (INSPIRE) / integrated
                      circuit (INSPIRE) / Planar pixel (autogen) / 3D pixel
                      (autogen) / Test beam (autogen) / Irradiation (autogen)},
      cin          = {FHTestBeam},
      ddc          = {530},
      cid          = {I:(DE-H253)FHTestBeam-20150203},
      pnm          = {6G3 - PETRA III (DESY) (POF4-6G3)},
      pid          = {G:(DE-HGF)POF4-6G3},
      experiment   = {EXP:(DE-H253)TestBeamline24-20150101},
      typ          = {PUB:(DE-HGF)8 / PUB:(DE-HGF)16},
      UT           = {WOS:001002117200001},
      doi          = {10.1016/j.nima.2022.167650},
      url          = {https://bib-pubdb1.desy.de/record/602028},
}