000574716 001__ 574716
000574716 005__ 20230219181944.0
000574716 0247_ $$2CORDIS$$aG:(EU-Grant)101070287$$d101070287
000574716 0247_ $$2CORDIS$$aG:(EU-Call)HORIZON-CL4-2021-DIGITAL-EMERGING-01$$dHORIZON-CL4-2021-DIGITAL-EMERGING-01
000574716 0247_ $$2originalID$$acorda_____he::101070287
000574716 035__ $$aG:(EU-Grant)101070287
000574716 150__ $$aLow power spintronics wireless autonomous node (SWAN) integrated circuits developed via spintronics technology accelerator platform$$y2022-10-01 - 2025-09-30
000574716 372__ $$aHORIZON-CL4-2021-DIGITAL-EMERGING-01$$s2022-10-01$$t2025-09-30
000574716 450__ $$aSWAN-on-chip$$wd$$y2022-10-01 - 2025-09-30
000574716 5101_ $$0I:(DE-588b)5098525-5$$2CORDIS$$aEuropean Union
000574716 680__ $$aOne of the central keystones of the digital transformation of society is the Internet of Things (IoT) paradigm, however recent focus has turned to the energy consumption of the billions of IoT sensor nodes. In order for the realisation of a ‘Green IoT’, low-power sensor nodes are essential, to extend node lifetime, reduce carbon footprint and reduce costs. Spintronics is an emerging technology which has been demonstrated for several key functionalities associated with wireless sensor networks, including sensing, energy harvesting, communication, memories and novel processing paradigms.

In SWAN-on-chip a spintronics wireless autonomous node (SWAN) is proposed for low-power edge computing. Three homogeneously CMOS integrated spin-chip modules will be developed and benchmarked in the context of low power IoT nodes (namely magnetic field sensor, wireless power transfer, wake-up receiver) (Objective 1), and these spin-chip modules will be brought together into a SWAN prototype functional demonstrator capable of real world data capture and used for specific end user test cases (i.e. electric vehicles and smart metering) (Objective 2).

As well as developing individual spin-chips, a system-on-chip style SWAN-on-chip concept will be validated, with different spintronic functionalities being interconnected via CMOS, either by using multi-functional spintronic stacks or masking techniques to allow multiple spintronics technologies to be processed on a single CMOS wafer (Objective 3).

In addition, the SWAN-on-chip concept will be used to validate the ‘spintronics technology accelerator’ platform, where the spintronics equivalent circuit models (Spin-EC) and spintronics multi-project wafer (Spin-MPW) will create a European-level pathway for the fabrication of monolithically integrated Spintronic/CMOS technologies required for boosting devices up the spintronics value chain (Objective 3).
000574716 909CO $$ooai:juser.fz-juelich.de:1000297$$pauthority:GRANT$$pauthority
000574716 909CO $$ooai:juser.fz-juelich.de:1000297
000574716 980__ $$aG
000574716 980__ $$aCORDIS
000574716 980__ $$aAUTHORITY