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@ARTICLE{Pennicard:207201,
      author       = {Pennicard, D. and Struth, B. and Hirsemann, H. and
                      Sarajlic, M. and Smoljanin, S. and Zuvic, M. and Lampert, M.
                      O. and Fritzsch, T. and Rothermund, M. and Graafsma, H.},
      title        = {{A} {G}ermanium {H}ybrid {P}ixel {D}etector with 55μm
                      {P}ixel {S}ize and 65,000 {C}hannels},
      journal      = {Journal of Instrumentation},
      volume       = {9},
      number       = {12},
      issn         = {1748-0221},
      address      = {London},
      publisher    = {Inst. of Physics},
      reportid     = {PUBDB-2015-01184},
      pages        = {P12003 - P12003},
      year         = {2014},
      note         = {OA},
      abstract     = {Hybrid pixel semiconductor detectors provide high
                      performance through a combination of direct detection, a
                      relatively small pixel size, fast readout and sophisticated
                      signal processing circuitry in each pixel. For X-ray
                      detection above 20 keV, high-Z sensor layers rather than
                      silicon are needed to achieve high quantum efficiency, but
                      many high-Z materials such as GaAs and CdTe often suffer
                      from poor material properties or nonuniformities. Germanium
                      is available in large wafers of extremely high quality,
                      making it an appealing option for high-performance hybrid
                      pixel X-ray detectors, but suitable technologies for finely
                      pixelating and bump-bonding germanium have not previously
                      been available.A finely-pixelated germanium photodiode
                      sensor with a 256 by 256 array of 55μm pixels has been
                      produced. The sensor has an n-on-p structure, with 700μm
                      thickness. Using a low-temperature indium bump process, this
                      sensor has been bonded to the Medipix3RX photoncounting
                      readout chip. Tests with the LAMBDA readout system have
                      shown that the detector works successfully, with a high bond
                      yield and higher image uniformity than comparable high-Z
                      systems. During cooling, the system is functional around
                      -80°C (with warmer temperatures resulting in excessive
                      leakage current), with -100°C sufficient for good
                      performance.},
      cin          = {FS-DS},
      ddc          = {610},
      cid          = {I:(DE-H253)FS-DS-20120731},
      pnm          = {541 - Photons (POF2-541)},
      pid          = {G:(DE-HGF)POF2-541},
      experiment   = {EXP:(DE-MLZ)NOSPEC-20140101},
      typ          = {PUB:(DE-HGF)16},
      UT           = {WOS:000345859200019},
      doi          = {10.1088/1748-0221/9/12/P12003},
      url          = {https://bib-pubdb1.desy.de/record/207201},
}