IEEE transactions on components, packaging and manufacturing technology
	Common abbreviations: IEEE Trans Compon Packaging Manuf Technol [iso] IEEE Trans Compon Packaging Manuf Technol [dnlm] IEEE Trans Compon Packaging Manuf Technol [iso]

Type:	journal
DDC:	620
Keywords(s):	Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials
CODEN:	ITCPC8
ISSN(s):	2156-3950, 2156-3985
Publisher:	IEEE : New York, NY 2011-
Country:	United States of America
Appears:	print, online
ID:	PERI:(DE-600)2595289-4

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Database coverage:
; Clarivate Analytics Master Journal List ; Current Contents - Electronics and Telecommunications Collection ; Current Contents - Engineering, Computing and Technology ; Ebsco Academic Search ; Essential Science Indicators ; IF < 5 ; JCR ; SCOPUS ; Science Citation Index Expanded ; Web of Science Core Collection